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ELECTRONICS & MICROELECTRONICS

 Mechanical Micromechanical Measurement
Electronic Microelectronic Measurement 2
 Application 3 : Ball Grid Array (BGA)
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    Aims :

  • Non contact measurement of the highly reflective gold contacts on the low reflectivity substrate,
  • Measurement of the contact height,
  • Control of the co-planarity of the contact summits.
Click on image to improve definition
Ball grid array (false color 3D represantation)
Zoomed image of a contact line extracted from image 1
1 - Ball grid array (false color 3D represantation)
2 - Zoomed image of a contact line extracted from image 1
Profile through image 2, allowing measuring the contact height and coplanarity
Measurement parameters
Measurement system :
MICROMESURE 2 Profilometer
Controller :
CHR 150
Optical pen :
CL2 MR 140
Sample :
Ball grid array
Material :
Epoxy and Gold
Picture size :
11 mm x 17 mm
Measurement pitch :
4 µm x 4 µm
3 - Profile through image 2, allowing measuring the contact height and coplanarity